Deepening ICT integration through multilevel design of technological pedagogical content knowledge

Ching Sing CHAI, Elizabeth KOH, Cher Ping LIM, Chin-Chung TSAI

Research output: Contribution to journalArticlespeer-review

Abstract

This paper reflects upon the ICT integration efforts of the last two decades. It reviews major frameworks that have been employed to make sense of ICT integration, and argues for a more significant change among educators at all levels given the pervasiveness of ICT in today’s society. An expanded version of the Technological Pedagogical Content Knowledge is proposed as a theoretical framework for creating new knowledge and innovative practices for ICT integration in educational settings. Copyright © 2014 Beijing Normal University and Springer-Verlag Berlin Heidelberg.
Original languageEnglish
Pages (from-to)1-17
JournalJournal of Computers in Education
Volume1
Issue number1
DOIs
Publication statusPublished - Mar 2014

Citation

Chai, C. S., Koh, E., Lim, C. P., & Tsai, C.-C. (2014). Deepening ICT integration through multilevel design of technological pedagogical content knowledge. Journal of Computers in Education, 1(1), 1-17.

Keywords

  • ICT integration
  • TPACK
  • Design knowledge

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