Cyclic scheduling of single-arm cluster tools with multiple wafer types: A case study

Xin Stephen LI, Jiongjiong TIAN

Research output: Chapter in Book/Report/Conference proceedingChapters

Abstract

Cluster tools are widely used in the industrial production process, such as semiconductor wafers, printing circuit board and other fields. In this paper, the scheduling problem of cluster tools with multi-type wafers is studied, including robot handling jobs sequencing and wafer processing sequencing. Based on the detailed analysis of the operations in the problem, there are the processing time window constraints, robot available constraints, processing capacity constraints. Then, due to the complexity in the general conditions, a case with four different wafers (including one for each type in a cycle) is considered. The applied model was solved by the third-party library Gurobi in PyCharm. Copyright © 2022 The authors and IOS Press.

Original languageEnglish
Title of host publicationApplied mathematics, modeling and computer simulation: Proceedings of AMMCS 2021
EditorsChi-Hua CHEN
Place of PublicationAmsterdam, Netherlands
PublisherIOS Press BV
Pages371-379
ISBN (Electronic)9781643682549
ISBN (Print)9781643682556
DOIs
Publication statusPublished - 2022

Citation

Li, X., & Tian, J. (2022). Cyclic scheduling of single-arm cluster tools with multiple wafer types: A case study. In C.-H. Chen (Ed.), Applied mathematics, modeling and computer simulation: Proceedings of AMMCS 2021 (pp. 371-379). IOS Press BV. https://doi.org/10.3233/ATDE220037

Keywords

  • Single-arm cluster tool
  • Multiple types of wafer
  • Shared processing chambers
  • Time window
  • Circle scheduling

Fingerprint

Dive into the research topics of 'Cyclic scheduling of single-arm cluster tools with multiple wafer types: A case study'. Together they form a unique fingerprint.