An events-driven scheduling algorithm for two-cluster tools with processing time windows

Xin Stephen LI, Richard Y.K. FUNG, Hongyi SUN

Research output: Chapter in Book/Report/Conference proceedingChapters

2 Citations (Scopus)

Abstract

This paper discusses a scheduling problem of two-cluster tools for multi-type wafers with processing time windows. Firstly, a decomposition method is used to decomposes the two-cluster tool into three reduced single-cluster tools (RCT). Then, an events-driven algorithm, based on the temporal constraint sets, is proposed for the reduced single-cluster tool with the objective of minimizing the time for completing a newly arriving wafer. The algorithm deals with the two-cluster tool situation while the three reduced single-cluster tools are composed again. The procedures are repeated for each arriving wafer. Simulation experiments indicate that the proposed algorithm is effective and practical in scheduling two-cluster tools under time constraints. Copyright © 2011 IEEE.

Original languageEnglish
Title of host publicationProceedings of 2011 IEEE International Conference on Industrial Engineering and Engineering Management
Place of PublicationUSA
PublisherIEEE
Pages1436-1440
ISBN (Electronic)9781457707391
ISBN (Print)9781457707407
DOIs
Publication statusPublished - 2011

Citation

Li, X., Fung, R. Y. K., & Sun, H. (2011). An events-driven scheduling algorithm for two-cluster tools with processing time windows. In Proceedings of 2011 IEEE International Conference on Industrial Engineering and Engineering Management (pp. 1436-1440). USA: IEEE.

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