A meta-analysis of STEM integration and student achievement: An engineering-design approach

Shuqi ZHOU, Zehua DONG, Hui-Hui WANG, Ming Ming CHIU

Research output: Contribution to conferencePapers

Abstract

This study meta-analyzed STEM integration’s effect on student achievement using 75 effect sizes from 36 studies of 13,001 learners. The results showed a moderate and positive overall effect of STEM integration on student STEM achievement (g = .668). The effect size was largest for context integration, smaller for content integration, and smallest for tool integration. Inquiry-based learning yielded the largest effect size with progressively smaller effect sizes for problem-based learning, design-based learning, and project-based learning. Effect sizes were smaller for standardized achievement assessments and for the United States. Experiment design type, intervention length, measured achievement subject, and publication type moderated STEM integration’s effect on student achievement. Whether involving engineering design skills or not didn’t moderate its effect on student achievement. Copyright © 2023 AERA.
Original languageEnglish
Publication statusPublished - Apr 2023
Event2023 Annual Meeting of American Educational Research Association: "Interrogating Consequential Education Research in Pursuit of Truth" - Chicago, United States
Duration: 13 Apr 202305 May 2023
https://www.aera.net/Events-Meetings/2023-Annual-Meeting

Conference

Conference2023 Annual Meeting of American Educational Research Association: "Interrogating Consequential Education Research in Pursuit of Truth"
Abbreviated titleAERA 2023
Country/TerritoryUnited States
CityChicago
Period13/04/2305/05/23
Internet address

Citation

Zhou, S., Dong, Z., Wang, H.-H., & Chiu, M. M. (2023, April). A meta-analysis of STEM integration and student achievement: An engineering-design approach. Paper presented at 2023 Annual Meeting of American Educational Research Association: "Interrogating Consequential Education Research in Pursuit of Truth", Chicago, USA.

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